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TLV2262AIPWLE Datasheet(PDF) 2 Page - STMicroelectronics |
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TLV2262AIPWLE Datasheet(HTML) 2 Page - STMicroelectronics |
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2 / 55 page  TLV226x, TLV226xA Advanced LinCMOS RAILTORAIL OPERATIONAL AMPLIFIERS SLOS186C − FEBRUARY 1997 − REVISED AUGUST 2006 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLV2262 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25 °C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (JG) PLASTIC DIP (P) TSSOP (PW) CERAMIC FLATPACK (U) 0 °C to 70°C 2.5 mV TLV2262CD — — TLV2262CP TLV2262CPWLE — −40 °C to 125°C 950 µV TLV2262AID — — TLV2262AIP TLV2262AIPWLE — −40 °C to 125°C 950 µV 2.5 mV TLV2262AID TLV2262ID — — — — TLV2262AIP TLV2262IP TLV2262AIPWLE — — — −40 °C to 125°C 950 µV TLV2262AQD — — — — — −40 °C to 125°C 950 µV 2.5 mV TLV2262AQD TLV2262QD — — — — — — — — — — −55 °C to 125°C 950 µV 2.5 mV — — TLV2262AMFK TLV2262MFK TLV2262AMJG TLV2262MJG — — — — TLV2262AMU TLV2262MU † The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR). ‡ The PW package is available only left-end taped and reeled. § Chips are tested at 25°C. ¶ For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. TLV2264 AVAILABLE OPTIONS PACKAGED DEVICES TA VIOmax AT 25 °C SMALL OUTLINE (D) CHIP CARRIER (FK) CERAMIC DIP (J) PLASTIC DIP (N) TSSOP (PW) CERAMIC FLATPACK (W) −40 °C to 950 µV TLV2264AID — — TLV2264AIN TLV2264AIPWLE — −40 C to 125 °C 950 µV 2.5 mV TLV2264AID TLV2264ID — — — — TLV2264AIN TLV2264IN TLV2264AIPWLE — — — −40 °C to 950 µV TLV2264AQD — — — — — −40 C to 125 °C 950 µV 2.5 mV TLV2264AQD TLV2264QD — — — — — — — — — — −55 °C to 125 °C 950 µV 2.5 mV — — TLV2264AMFK TLV2264MFK TLV2264AMJ TLV2264MJ — — — — TLV2264AMW TLV2264MW † The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262IDR). ‡ The PW package is available only left-end taped and reeled. § Chips are tested at 25°C. ¶ For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. |
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