1999 Nov 11

4

Philips Semiconductors

Product specification

Ultra-fast soft-recovery

controlled avalanche rectifiers

BYD57 series

THERMAL CHARACTERISTICS

Note

1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer

≥40 µm, see Fig.17.

For more information please refer to the

‘General Part of associated Handbook’.

maximum slope of reverse recovery

current

when switched from

see Fig.19

BYD57D to J

−−

7A/

µs

BYD57K and M

−−

6A/

µs

BYD57U and V

−−

5A/

µs

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction to tie-point

30

K/W

thermal resistance from junction to ambient

note 1

150

K/W

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

dI

R

dt

--------