MSPM0C1104SDYYR datasheet(4/77 Pages) TI

4 / 77 page

Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................2

4 Functional Block Diagram.............................................. 3

5 Device Comparison......................................................... 5

6 Pin Configuration and Functions...................................6

6.1 Pin Diagrams.............................................................. 6

6.2 Pin Attributes...............................................................7

6.3 Signal Descriptions..................................................... 8

6.4 Connections for Unused Pins....................................11

7 Specifications................................................................ 12

7.1 Absolute Maximum Ratings...................................... 12

7.2 ESD Ratings............................................................. 12

7.3 Recommended Operating Conditions.......................12

7.4 Thermal Information..................................................13

7.5 Supply Current Characteristics................................. 13

7.6 Power Supply Sequencing........................................14

7.7 Flash Memory Characteristics.................................. 15

7.8 Timing Characteristics...............................................16

7.9 Clock Specifications..................................................16

7.10 Digital IO................................................................. 17

7.11 ADC.........................................................................18

7.12 Temperature Sensor............................................... 20

7.13 VREF...................................................................... 21

7.14 I2C.......................................................................... 21

7.15 SPI.......................................................................... 22

7.16 UART...................................................................... 24

7.17 TIMx........................................................................ 24

7.18 Windowed Watchdog Characteristics..................... 24

7.19 Emulation and Debug............................................. 25

8 Detailed Description......................................................26

8.1 CPU.......................................................................... 26

8.2 Operating Modes...................................................... 26

8.3 Power Management Unit (PMU)............................... 27

8.4 Clock Module (CKM).................................................28

8.5 DMA.......................................................................... 28

8.6 Events....................................................................... 29

8.7 Memory..................................................................... 29

8.8 Flash Memory........................................................... 31

8.9 SRAM........................................................................31

8.10 GPIO....................................................................... 31

8.11 IOMUX.................................................................... 32

8.12 ADC........................................................................ 32

8.13 Temperature Sensor............................................... 32

8.14 VREF...................................................................... 32

8.15 CRC........................................................................ 32

8.16 UART...................................................................... 33

8.17 SPI.......................................................................... 33

8.18 I2C.......................................................................... 33

8.19 WWDT.................................................................... 34

8.20 Timers (TIMx)..........................................................34

8.21 Input/Output Diagrams............................................35

8.22 Serial Wire Debug Interface....................................36

8.23 Device Factory Constants ......................................37

8.24 Identification............................................................37

9 Applications, Implementation, and Layout................. 38

9.1 Typical Application.................................................... 38

10 Device and Documentation Support..........................39

10.1 Device Nomenclature..............................................39

10.2 Tools and Software................................................. 40

10.3 Support Resources................................................. 40

10.4 Trademarks.............................................................40

10.5 Electrostatic Discharge Caution..............................41

10.6 Glossary..................................................................41

11 Mechanical, Packaging, and Orderable

Information.................................................................... 42

12 Revision History.......................................................... 61

MSPM0C1104, MSPM0C1103

SLASF90 – OCTOBER 2023

www.ti.com

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