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TLV75533PDBVR Datasheet(PDF) 21 Page - Texas Instruments |
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TLV75533PDBVR Datasheet(HTML) 21 Page - Texas Instruments |
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21 / 44 page ![]() VIN VOUT GND PLANE Represents via used for application specific connections 1 2 3 4 6 C IN C OUT EN 5 VOUT VIN GND PLANE Represents via used for application specific connections 1 2 3 4 5 C OUT C IN EN OUT IN GND PLANE Represents via used for application specific connections 1 2 3 4 C IN C OUT EN 21 TLV755P www.ti.com SBVS320A – NOVEMBER 2017 – REVISED MAY 2018 Product Folder Links: TLV755P Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated 10 Layout 10.1 Layout Guidelines • Place input and output capacitors as close as possible to the device. • Use copper planes for device connections to optimize thermal performance. • Place thermal vias around the device to distribute the heat. 10.2 Layout Examples Figure 32. Layout Example for the DQN Package Figure 33. Layout Example for the DBV Package Figure 34. Layout Example for the DRV Package |
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