49

05/02

+: J for

∆R

5 %

Kfor

∆R

10 k

8503

4390

4470

4500

B57231V2103+060

15 k

8503

4390

4470

4500

B57231V2153+060

22 k

8503

4390

4470

4500

B57231V2223+060

33 k

8503

4390

4470

4500

B57231V2333+060

47 k

8503

4390

4470

4500

B57231V2473+060

Reliability data

SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a

standardized PCB in accordance with IEC 60539-1.

Test

Standard

Test conditions

∆R

(typical)

Remarks

Storage in

dry heat

IEC

60068-2-2

JIS C 0021

Storage at upper

category temperature

T: (125

± 2) °C

t: 1000 h

< 2 %

Storage in damp

heat, steady state

IEC

60068-2-3

JIS C 0022

Temperature of air: (40

± 2) °C

Relative humidity of air:

(93 +2 /–3) %

Duration: 56 days

< 2 %

Rapid temperature

cycling

IEC

60068-2-14

JIS C 0025

Lower test temperature: – 55

°C

Upper test temperature: 125

°C

Number of cycles: 100

< 2 %

Endurance

T: (65

± 2) °C

t: 1000 h

< 2 %

Solderability

IEC

60068-2-58

JIS C 0054

Solderability:

(215

± 3) °C / (3 ± 0,3) s

(235

± 5) °C / (2 ± 0,2) s

Resistance to soldering heat:

(260

± 5) °C / (10 ± 1) s

95 % of

terminations

wetted

Resistance drift

after soldering

Reflow soldering profile

< 1 %

Ω

No. of R/T

characteristic

K

K

K

Ordering code

B572**

Temperature Measurement

V2**

SMD NTC Thermistors with Nickel Barrier Termination, Size 0402