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Application Using a Single-Layer PCB

UseasMuchCopper Area

asPossibleforHeatSpread

PackageThermalPad

PackageOutline

TPL9201

8-CHANNEL RELAY DRIVER

WITH INTEGRATED 5-V LDO AND ZERO-VOLT DETECTION

SLIS123B – JUNE 2006 – REVISED NOVEMBER 2006

APPLICATION INFORMATION (continued)

In a single-layer board application, the thermal pad is attached to a heat spreader (copper area) by using the low

thermal-impedance attachment method (solder paste or thermal-conductive epoxy). With either method, it is

advisable to use as much copper trace area as possible to dissipate the heat.

CAUTION:

If the attachment method is not implemented correctly, the functionality of the

product cannot be assured. Power-dissipation capability is adversely affected if

the device is incorrectly mounted onto the circuit board.

Figure 6. Layout Recommendations for a Single-Layer PCB

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