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5、电性规格 Specification

6、焊接和安装 Soldering and Mounting

6-1. Soldering

6.2 Solder re-flow:

6.3 Soldering Iron(Figure 2):

7、包装信息 Packaging Information

Part Number

Inductance(uH)

[100kHz/0.1V]

-30% / +50%

DC Resistance

(Ω)Max.

Common mode

Impedance (Ω)

[

Test Frequency

100MHz]

Rated

Current

(mA)

Rated Volt.

(Vdc)

Withstand Volt.

(Vdc)

max.

IR(Ω) min.

AC4532F-110L

11

0.6

600TYP

250

50

125

10M

AC4532F-220L

22

1.0

1200 TYP

200

50

125

10M

AC4532F-510L

51

1.0

2800 TYP

200

50

125

10M

AC4532F-101L

101

2.0

5800 TYP

150

50

125

10M

AC4532F-201L

201

4.5

/

110

50

125

10M

Series

Chip/Reel

Carton

4532F

2500

25000

Recommended temperature profiles for re-flow soldering in Figure 1.

Mildly activated rosin fluxes are preferred. FPE terminations are suitable for all wave and re-flow soldering systems.

If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.

Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event

that a soldering iron must be employed the following precautions are recommended.

‧Preheat circuit and products to 150℃

‧Never contact the ceramic with the iron tip

‧Use a 20 watt soldering iron with tip diameter of 1.0mm

‧350℃ tip temperature (max)

‧1.0mm tip diameter (max)

‧Limit soldering time to 4~5 sec.