SMSC DB – LPC47N237

Page 5

Revision 0.3 (03-30-07)

PRODUCT PREVIEW

Package Outline

Figure 2 – 100 Pin TQFP Package Outline

Table 1 – 100 Pin TQFP Package Parameters

MIN

NOMINAL

MAX

REMARKS

A

~

~

1.60

Overall Package Height

A1

0.05

~

0.15

Standoff

A2

1.35

~

1.45

Body Thickness

D

15.80

~

16.20

X Span

D1

13.90

~

14.10

X body Size

E

15.80

~

16.20

Y Span

E1

13.90

~

14.10

Y body Size

H

0.09

~

0.20

Lead Frame Thickness

L

0.45

0.60

0.75

Lead Foot Length

L1

~

1.00

~

Lead Length

e

0.50 Basic

Lead Pitch

θ

0

o

~

7

o

Lead Foot Angle

W

0.17

0.22

0.27

Lead Width

R1

0.08

~

~

Lead Shoulder Radius

R2

0.08

~

0.20

Lead Foot Radius

ccc

~

~

0.08

Coplanarity

Notes:

1.

Controlling Unit: millimeter.

2.

Tolerance on the position of the leads is ± 0.04 mm maximum.

3.

Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm.

4.

Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

5.

Details of pin 1 identifier are optional but must be located within the zone indicated.