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IRF7341Q Datasheet(PDF) 2 Page - International Rectifier

Part # IRF7341Q
Description  HEXFET Power MOSFET
PDF  9 Pages
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Manufacturer  IRF [International Rectifier]
Direct Link  http://www.irf.com
Logo IRF - International Rectifier

IRF7341Q Datasheet(HTML) 2 Page - International Rectifier

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IRF7341Q
2
www.irf.com
Parameter
Min. Typ. Max. Units
Conditions
IS
Continuous Source Current
MOSFET symbol
(Body Diode)
showing the
ISM
Pulsed Source Current
integral reverse
(Body Diode)

p-n junction diode.
VSD
Diode Forward Voltage
–––
–––
1.2
V
TJ = 25°C, IS = 2.6A, VGS = 0V
‚
trr
Reverse Recovery Time
–––
51
77
ns
TJ = 25°C, IF = 2.6A
Qrr
Reverse Recovery Charge
–––
76
114
nC
di/dt = 100A/µs
‚
Source-Drain Ratings and Characteristics
––– –––
––– –––
42
2.4
A
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS
Drain-to-Source Breakdown Voltage
55
–––
–––
V
VGS = 0V, ID = 250µA
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient
––– 0.052 –––
V/°C
Reference to 25°C, ID = 1mA
––– 0.043 0.050
VGS = 10V, ID = 5.1A
‚
––– 0.056 0.065
VGS = 4.5V, ID = 4.42A
‚
VGS(th)
Gate Threshold Voltage
1.0
–––
–––
V
VDS = VGS, ID = 250µA
gfs
Forward Transconductance
10.4
–––
–––
S
VDS = 10V, ID = 5.2A
–––
–––
2.0
VDS = 44V, VGS = 0V
–––
–––
25
VDS = 44V, VGS = 0V, TJ = 150°C
Gate-to-Source Forward Leakage
–––
–––
100
VGS = 20V
Gate-to-Source Reverse Leakage
–––
–––
-100
VGS = -20V
Qg
Total Gate Charge
–––
29
44
ID = 5.2A
Qgs
Gate-to-Source Charge
–––
2.9
4.4
nC
VDS = 44V
Qgd
Gate-to-Drain ("Miller") Charge
–––
7.3
11
VGS = 10V
td(on)
Turn-On Delay Time
–––
9.2
–––
VDD = 28V
tr
Rise Time
–––
7.7
–––
ID = 1.0A
td(off)
Turn-Off Delay Time
–––
31
–––
RG = 6.0Ω
tf
Fall Time
–––
12.5
–––
VGS = 10V
‚
Ciss
Input Capacitance
–––
780
–––
VGS = 0V
Coss
Output Capacitance
–––
190
–––
pF
VDS = 25V
Crss
Reverse Transfer Capacitance
–––
66
–––
ƒ = 1.0MHz
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
IGSS
µA
Ω
RDS(on)
Static Drain-to-Source On-Resistance
IDSS
Drain-to-Source Leakage Current
nA
ns
Notes:
 Repetitive rating; pulse width limited by
max. junction temperature.
‚ Pulse width ≤ 300µs; duty cycle ≤ 2%.
ƒ Surface mounted on FR-4 board, t ≤ 10sec.
S
D
G



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