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PCF1172CU Datasheet(PDF) 7 Page - NXP Semiconductors |
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PCF1172CU Datasheet(HTML) 7 Page - NXP Semiconductors |
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7 / 16 page ![]() 1997 Apr 16 7 Philips Semiconductors Product specification 31/2-digit LCD car clock PCF1172C CHIP DIMENSIONS AND BONDING PAD LOCATIONS Fig.4 Bonding pad locations, PCF1172CU; 40 terminals. n.c. = not connected. Chip area: 6.28 mm2. Bonding pad dimensions: 110 µm × 110 µm. Chip thickness: 381 ±25 µm. MSA988 PCF1172CU G2 F2 A2 B2 P3, P4 P1, P2 G3 F3 A3 B3 G4 F4 PM AM E2 D2 C2 E3 D3 C3 E4 D4 C4 x y 2.36 mm 2.66 mm 0 0 |
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