ZXMN6A25K

Issue 3 - Novmber 2006

2

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© Zetex Semiconductors plc 2006

Absolute maximum ratings

NOTES:

(a) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in

still air conditions.

(b) For a device surface mounted on FR4 PCB measured at t

10 sec.

(c) Repetitive rating 50mm x 50mm x 1.6mm FR4 PCB, D=0.02 pulse width=300 s - pulse width limited by maximum

junction temperature.

(d) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz. copper, in

still air conditions.

Parameter

Symbol

Limit

Unit

Drain-source voltage

60

V

Gate-source voltage

±20

V

Continuous drain current

(b)

10.7

A

(b)

8.6

A

(a)

7A

Pulsed drain current(c)

36

A

Continuous source current (body diode)(b)

11.8

A

Pulsed source current (body diode)(c)

36

A

(a)

4.25

W

Linear derating factor

34

mW/°C

(b)

9.85

W

Linear derating factor

78.7

mW/°C

(d)

2.11

W

Linear derating factor

16.8

mW/°C

Operating and storage temperature range

-55 to +150

°C

Thermal resistance

Parameter

Symbol

Limit

Unit

Junction to ambient(a)

29.4

°C/W

Junction to ambient(b)

12.7

°C/W

Junction to ambient(d)

59.1

°C/W