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PCF1174CU Datasheet(PDF) 11 Page - NXP Semiconductors |
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PCF1174CU Datasheet(HTML) 11 Page - NXP Semiconductors |
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11 / 20 page ![]() 1997 Apr 16 11 Philips Semiconductors Product specification 4-digit static LCD car clock PCF1174C CHIP DIMENSIONS AND BONDING PAD LOCATIONS Fig.7 Bonding pad locations, PCF1174CU; 40 terminals. Chip area: 6.4 mm2. Bonding pad dimensions: 110 µm × 110 µm. Chip thickness: 381 ±25 mm. MSA998 0 0 2.12 mm FLASH x SEL S2 A4 F4 G4 B3 AD3 F3 G3 COL B2 PCF1174CU DATA S1 B4 C4 D4 E4 C3 E3 C2 D2 E2 C1 3.02 mm y |
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