5.4 Thermal Information

THERMAL METRIC(1)

ISO1228

UNIT

DFB (SSOP)

38 PINS

RθJA

Junction-to-ambient thermal resistance

91.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

50.5

°C/W

RθJB

Junction-to-board thermal resistance

58.2

°C/W

ψJT

Junction-to-top characterization parameter

30.3

°C/W

ψJB

Junction-to-board characterization parameter

57.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO1228

PD

Maximum power dissipation (both sides)

AVCC = 24 V, VCC1 = 5.5 V, TJ = 150°C,

CL = 15 pF, SPI Frequency = 25 MHz, INx

= 30 V, RILIM = 1k Ω

565

mW

PDF

Maximum power dissipation (Field Side)

535

mW

PDL

Maximum power dissipation (Logic Side)

30

mW

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ISO1228

SLLSFN5A – JUNE 2023 – REVISED FEBRUARY 2024

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