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PEMB4 Datasheet(PDF) 3 Page - NXP Semiconductors

Part # PEMB4
Description  PNP resistor-equipped double transistor R1 = 10 kohm, R2 = open
PDF  8 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PEMB4 Datasheet(HTML) 3 Page - NXP Semiconductors

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2001 Sep 14
3
Philips Semiconductors
Preliminary specification
PNP resistor-equipped double transistor
R1=10k
Ω, R2 = open
PEMB4
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1. Transistor mounted on an FR4 printed-circuit board.
THERMAL CHARACTERISTICS
Notes
1. Transistor mounted on an FR4 printed-circuit board.
2. The only recommended soldering method is reflow soldering.
CHARACTERISTICS
Tamb =25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Per transistor
VCBO
collector-base voltage
open emitter
−−50
V
VCEO
collector-emitter voltage
open base
−−50
V
VEBO
emitter-base voltage
open collector
−−5V
IO
output current (DC)
−−100
mA
ICM
peak collector current
−−100
mA
Ptot
total power dissipation
Tamb ≤ 25 °C; note 1
−
200
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
−
150
°C
Tamb
operating ambient temperature
−65
+150
°C
Per device
Ptot
total power dissipation
Tamb ≤ 25 °C; note 1
−
300
mW
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient
notes 1 and 2
416
K/W
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Per transistor
ICBO
collector cut-off current
IE = 0; VCB = −50 V
−−−100
nA
ICEO
collector cut-off current
IB = 0; VCE = −50 V
−−−1
µA
IB = 0; VCE = −30 V; Tj = 150 °C
−−−50
µA
IEBO
emitter cut-off current
IC = 0; VEB = −5V
−−−100
nA
hFE
DC current gain
IC = −1 mA; VCE = −5 V
100
−
600
VCEsat
collector-emitter saturation voltage
IC = −10 mA; IB = −0.5 mA
−−−300
mV
R1
input resistor
7
10
13
k
Ω
Cc
collector capacitance
IE =ie = 0; VCB = −10 V; f = 1 MHz
−−
5pF



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