TL072ACDR datasheet(14/86 Pages) TI1

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6.6 Thermal Information for Quad Channel

THERMAL METRIC (1)

TL074xx

UNIT

(SOIC)

DYY

(SOT-23)

(TSSOP)

14 PINS

20 PINS

14 PINS

RθJA

Junction-to-ambient thermal

resistance

114.2

153.2

–

128.8

°C/W

Rθ

JC(top)

Junction-to-case (top) thermal

resistance

70.3

88.7

5.61

14.5

–

14.5

56.1

°C/W

RθJB

Junction-to-board thermal

resistance

70.2

65.4

–

127.6

°C/W

ψJT

Junction-to-top

characterization parameter

28.8

9.5

–

°C/W

ψJB

Junction-to-board

characterization parameter

69.8

65.0

–

106.1

°C/W

Rθ

JC(bot)

Junction-to-case (bottom)

thermal resistance

N/A

–

0.5

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

TL071, TL071A, TL071B, TL071H

TL072, TL072A, TL072B, TL072H, TL072M

TL074, TL074A, TL074B, TL074H, TL074M

SLOS080V – SEPTEMBER 1978 – REVISED APRIL 2023

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TL074B TL074H TL074M

TL072ACDR Datasheet(PDF) 14 Page - Texas Instruments

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