ESDA14V2-4BF2

6/7

Figure 16: FLIP-CHIP Tape and Reel Specification

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 +/- 0.1

4 +/- 0.1

Ø 1.5 +/- 0.1

0.73 +/- 0.05

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These

packages have a Lead-free second level interconnect . The category of second level interconnect is

marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings relat-

ed to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECO-

PACK specifications are available at: www.st.com.

Table 4: Ordering Information

Note: More informations are available in the application notes:

AN1235: “Flip-Chip: Package description and recommendations for use”

Ordering code

Marking

Package

Weight

Base qty

Delivery mode

ESDA14V2-4BF2

EA

Flip-Chip

2.1 mg

5000

Tape & reel 7”

Table 5: Revision History

Date

Revision

Description of Changes

14-Mar-2005

1

First issue.

18-Oct-2005

2

Dimension from center bump to corner bump changed in

Figure 13 to indicate diagonal instead of perpendicular

measurement. No values changed. ECOPACK statement

added.

17-Jan-2006

3

Die dimensions changed in Figure 13. Cavity depth

changed in Figure 16