GaAs MMIC Voltage Variable Absorptive Attenuator

DC - 12 GHz

MAAA2000G

M/A-COM Inc. and its affiliates reserve the right to make changes to the

product(s) or information contained herein without notice. M/A-COM makes

no warranty, representation or guarantee regarding the suitability of its

products for any particular purpose, nor does M/A-COM assume any liability

whatsoever arising out of the use or application of any product(s) or

information.

• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macom.com for additional data sheets and product information.

V3

3

RoHS

Compliant

Handling Procedures

Permanent damage to the MAAA2000G may occur if the

following precautions are not adhered to:

A.

Cleanliness - The MAAA2000G should be handled in

a clean environment.

DO NOT attempt to clean

assembly after the MAAA2000G is installed.

B.

Static Sensitivity - All die handling equipment and

personnel should be DC grounded.

C.

Transients - Avoid instrument and power supply

transients

while

bias

is

connected

to

the

MAAA2000G. Use shielded signal and bias cables

to minimize inductive pick-up.

D.

Bias - Apply voltage to either control port A1/B2 or

A2/B1 only when the other is grounded. Neither port

should be allowed to “float”.

E.

General Handling - It is recommended that the

MAAA2000G chip be handled along the long side of

the die with a sharp pair of bend tweezers. DO NOT

touch the surface of the chip with fingers or

tweezers.

Mounting

The MAAA2000G is back-metallized with Pd/Ni/Au

(100/1,000/10,000Å) metallization. It can be die-mounted

using Au/Sn eutectic preforms or a thermally conductive

epoxy. The package surface should be clean and flat

before attachment.

Eutectic Die Attach:

A.

An 80/20 Au/Sn preform is recommended with a

work surface temperature of approximately 255°C

and a tool temperature of 265°C.

When hot 90/5

nitrogen/hydrogen gas is applied, solder temperature

should be approximately 290°C.

B.

DO NOT expose the MAAA2000G to a temperature

greater than 320°C for more than 20 seconds. No

more than 3 seconds of scrubbing should be

required for attachment.

Epoxy Die Attach:

A.

Apply a minimum amount of epoxy and place the

MAAA2000G into position. A thin epoxy fillet should

be visible around the perimeter of the die.

B.

Cure

epoxy

per

manufacturer’s

recommended

schedule.

C.

Electrically conductive epoxy is recommended but is

not required.

Bonding

A.

Ball or wedge bond with 1.0 mil diameter pure gold

wire. Thermosonic bonding with a nominal stage

temperature of 150°C and a ball bonding force of 40

to 50 grams or wedge bonding force of 18 to 22

grams is recommended. Ultrasonic energy and time

should be adjusted to the minimum levels necessary

to achieve reliable wirebonds.

nated on the package. GND bonds should be as

short as possible; at least three and no more than

four bond wires from ground pads to package are

recommended.