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PHT4NQ10LT Datasheet(PDF) 2 Page - NXP Semiconductors

Part # PHT4NQ10LT
Description  N-channel enhancement mode field-effect transistor
PDF  13 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PHT4NQ10LT Datasheet(HTML) 2 Page - NXP Semiconductors

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Philips Semiconductors
PHT4NQ10LT
N-channel enhancement mode field-effect transistor
Product specification
Rev. 01 — 11 September 2000
2 of 13
9397 750 07342
© Philips Electronics N.V. 2000. All rights reserved.
5.
Quick reference data
6.
Limiting values
Table 2:
Quick reference data
Symbol Parameter
Conditions
Typ
Max
Unit
VDS
drain-source voltage (DC)
Tj =25to150 °C
−
100
V
ID
drain current (DC)
Tsp =25 °C; VGS =5V
−
3.5
A
Ptot
total power dissipation
Tsp =25 °C
−
6.9
W
Tj
junction temperature
−
150
°C
RDSon
drain-source on-state resistance
VGS =5V; ID = 1.75 A
200
250
m
Ω
Table 3:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage (DC)
Tj =25to150 °C
−
100
V
VDGR
drain-gate voltage (DC)
Tj =25to150 °C; RGS =20kΩ−
100
V
VGS
gate-source voltage (DC)
−±16
V
ID
drain current (DC)
Tsp =25 °C; VGS =5V; Figure 2 and 3
−
3.5
A
Tsp = 100 °C; VGS =5V;
−
2.2
A
IDM
peak drain current
Tsp =25 °C; pulsed; tp ≤ 10 µs; Figure 3
−
14
A
Ptot
total power dissipation
Tsp =25 °C; Figure 1
−
6.9
W
Tstg
storage temperature
−65
+150
°C
Tj
operating junction temperature
−65
+150
°C
Source-drain diode
IS
source (diode forward) current (DC)
Tsp =25 °C
−
3.5
A
ISM
peak source (diode forward) current Tsp =25 °C; tp ≤ 10 µs
−
14
A
Avalanche ruggedness
EAS
non-repetitive avalanche energy
unclamped inductive load; ID = 3.5 A;
tp = 0.2 ms; VDD ≤ 15 V; RGS =50 Ω;
VGS = 5 V; starting Tj =25 °C; Figure 4
−
45
mJ
IAS
non-repetitive avalanche current
unclamped inductive load; VDD ≤ 15 V;
RGS =50 Ω; VGS =5V; Figure 4
−
3.5
A



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