SE2521A80-R datasheet(10/13 Pages) SKYWORKS

10 / 13 page

DATA SHEET

SE2521A80: 2.4 GHz Wireless LAN Front-End

Preliminary

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

202417A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • September 25, 2012

Package Information

Figure 7 shows the detailed device package diagram. The pads on the Skyworks RF modules are plated with gold

over nickel, with a gold thickness of nominally 0.75 um. The modules can be reflowed onto FR4 based material using

eutectic SnPb or common tin based Pb free solder pastes.

GND

TOP SIDE

BOTTOM SIDE

NOTES :

SIGNAL PAD

DETAIL

GROUND PAD

DETAIL

GND

Figure 7: SE2521A80 Package Diagram

Package Handling Information

Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed

regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption

may occur when the part is subjected to high temperature during solder assembly. The SE2521A80 is capable of

withstanding a Pb free solder reflow. Care must be taken when attaching this product, whether it is done manually or

in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that

the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For

details on both attachment techniques, precautions, and handling procedures recommended, please refer to:



“Land Grid Array Module Solder Reflow & Rework Information”, Document Number QAD-00046



“Handling, Packing, Shipping and Use of Moisture Sensitive LGA”, Document Number QAD-00047

SE2521A80-R Datasheet(PDF) 10 Page - Skyworks Solutions Inc.