Specifications and information are subject to change without notice

WJ Communications, Inc

• Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com

Page 5 of 5

October 2006

SCG015

¼ Watt, High Linearity InGaP HBT Amplifier

Product Information

The Communications Edge

TM

SCG015B-G Mechanical Information

This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260

°C reflow temperature) and leaded

(maximum 245

°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.

Outline Drawing

Land Pattern

Thermal Specifications

Parameter

Rating

Operating Case Temperature

-40 to +85

°C

Thermal Resistance, Rth

(1)

128

°C / W

Junction Temperature, Tjc

(2)

149

°C

Notes:

1. The thermal resistance is referenced from the junction-

to-case at a case temperature of 85

° C.

2. This corresponds to the typical biasing condition of

+5V, 100 mA at an 85

° C case temperature. A

minimum MTTF of 1 million hours is achieved for

junction temperatures below 247

° C.

Tjc = Tcase + Rth * Vde * Icc

Product Marking

The component will be marked with an

“S015G” designator with an alphanumeric lot

code on the top surface of the package.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

ESD / MSL Information

ESD Rating:

Class 1B

Value:

Passes at between 500 and 1000V

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

MSL Rating:

Level 3 at +260

°C convection reflow

Standard:

JEDEC Standard J-STD-020

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper performance of

this device. Vias should use a .35mm (#80 / .0135”) diameter

drill and have a final plated thru diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer layers near

the part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the board

to a heatsink.

Ensure that the ground / thermal via region

contacts the heatsink.

4. Do not put solder mask on the backside of the PC board in the

region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material and

construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are in

degrees.

MTTF vs. GND Tab Temperature

100

1000

10000

100000

60

70

80

90

100

110

120

Tab Temperature (°C)