Analog Integrated Circuit Device Data

Freescale Semiconductor

7

33389

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

THERMAL RESISTANCE

RTH, RTL Termination Resistance

500 to 16 k

Ω

Junction to Heatsink Thermal Resistance for HSOP-20

33% Power on V1, 66% on V2 (including CAN) (2)

3.1

°C/W

Junction to Pin Thermal Resistance for SO-28WD (3)

17

°C/W

Thermal Shutdown Temperature

165

°C

Peak Package Reflow Temperature During Reflow (4), (5)

Note 5

°C

Notes

2.

Refer to thermal management in device description section.

3.

Refer to thermal management in device section. Ground pins 6, 7, 8, 9, 20, 21, 22, and 23 of SO28WB package.

4.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

5.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL),

Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.

MC33xxxD enter 33xxx), and review parametrics.

Table 3. Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit