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2-499
RF3166
Rev A3 061031
Application Schematic
Evaluation Board Schematic
50
Ωμstrip
50
Ωμstrip
50
Ωμstrip
50
Ωμstrip
DCS/PCS IN
BAND SELECT
TX ENABLE
VBATT
VRAMP
GSM IN
DCS/PCS OUT
GSM OUT
9
1
3
2
6
5
4
8
7
50
Ω μstrip
50
Ω μstrip
50
Ω μstrip
50
Ω μstrip
BAND SELECT
TX ENABLE
VBATT
VRAMP
22
μF*
Notes:
* The value of the VBATT decoupling capacitor depends on the noise level of the phone board.
Capacitor type may be either tantalum or ceramic. Some applications may not require this capacitor.
1. All the PA output measurements are referenced to the PA output pad (pins 8 and 9).
2. The 50
Ω μstrip between the PA output pad and the SMA connector has an approximate insertion loss
of 0.1 dB for GSM850/EGSM900 and 0.2 dB for DCS1800/PCS1900 bands.
GND
P1
1
CON1
DCS/PCS IN
GSM IN
DCS/PCS OUT
GSM OUT
VCC
P2
1
CON1
P2-1
9
1
3
2
6
5
4
8
7
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