7 / 8 page
Page No. : 7/8
DS-AX1509-01 Aug, 2006
www.Orister.com
Soldering Methods for Orister’s Products
1. Storage environment: Temperature=10
oC~35oC Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (TL to TP)
<3
oC/sec
<3
oC/sec
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
100
oC
150
oC
60~120 sec
150
oC
200
oC
60~180 sec
Tsmax to TL
- Ramp-up Rate
<3
oC/sec
<3
oC/sec
Time maintained above:
- Temperature (TL)
- Time (tL)
183
oC
60~150 sec
217
oC
60~150 sec
Peak Temperature (TP)
240
oC +0/-5oC
260
oC +0/-5oC
Time within 5
oC of actual Peak
Temperature (tP)
10~30 sec
20~40 sec
Ramp-down Rate
<6
oC/sec
<6
oC/sec
Time 25
oC to Peak Temperature
<6 minutes
<8 minutes
3. Flow (wave) soldering (solder dipping)
Products
Peak temperature
Dipping time
Pb devices.
245
oC ±5oC
5sec
±1sec
Pb-Free devices.
260
oC +0/-5oC
5sec
±1sec
Figure 1: Temperature profile
tP
tL
Ramp-down
Ramp-up
Tsmax
Tsmin
Critical Zone
TL to TP
tS
Preheat
TL
TP
25
t 25oC to Peak
Time
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
