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TDA1016 Datasheet(PDF) 8 Page - NXP Semiconductors |
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TDA1016 Datasheet(HTML) 8 Page - NXP Semiconductors |
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8 / 9 page ![]() August 1987 8 Philips Semiconductors Product specification Recording/playback and 2 W audio power amplifier TDA1016 PACKAGE OUTLINE UNIT A max. 1 2 b1 cE e MH L REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches DIMENSIONS (inch dimensions are derived from the original mm dimensions) SOT38-1 92-10-02 95-01-19 A min. A max. b max. w ME e 1 1.40 1.14 0.055 0.045 0.53 0.38 0.32 0.23 21.8 21.4 0.86 0.84 6.48 6.20 0.26 0.24 3.9 3.4 0.15 0.13 0.254 2.54 7.62 0.30 8.25 7.80 0.32 0.31 9.5 8.3 0.37 0.33 2.2 0.087 4.7 0.51 3.7 0.15 0.021 0.015 0.013 0.009 0.01 0.10 0.020 0.19 050G09 MO-001AE MH c (e ) 1 ME A L A1 w M b1 e D A2 Z 16 1 9 8 b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. (1) (1) D (1) Z DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 |
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