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TLC2202CPSRG4 Datasheet(PDF) 6 Page - Texas Instruments |
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TLC2202CPSRG4 Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 66 page  TLC220x, TLC220xA, TLC220xB, TLC220xY Advanced LinCMOS ™ LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS SLOS175 – FEBRUARY 1997 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC2202Y chip formation This chip, when properly assembled, displays characteristics similar to the TLC2202C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – 1OUT 1IN + 1IN – VDD+ (8) (6) (3) (2) (5) (1) – + (7) 2IN + 2IN – 2OUT (4) VDD– 100 80 (1) (2) (3) (4) (5) (6) (7) (8) |
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