19

LT1228

1228fc

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTIO

J8 Package

8-Lead CERDIP (Narrow .300 Inch, Hermetic)

(Reference LTC DWG # 05-08-1110)

N8 Package

8-Lead PDIP (Narrow .300 Inch)

(Reference LTC DWG # 05-08-1510)

S8 Package

8-Lead Plastic Small Outline (Narrow .150 Inch)

(Reference LTC DWG # 05-08-1610)

OBSOLETE PACKAGE

J8 0801

.014 – .026

(0.360 – 0.660)

.200

(5.080)

MAX

.015 – .060

(0.381 – 1.524)

.125

3.175

MIN

.100

(2.54)

BSC

.300 BSC

(7.62 BSC)

.008 – .018

(0.203 – 0.457)

0

° – 15°

.005

(0.127)

MIN

.405

(10.287)

MAX

.220 – .310

(5.588 – 7.874)

12

3

4

87

65

.025

(0.635)

RAD TYP

.045 – .068

(1.143 – 1.650)

FULL LEAD

OPTION

.023 – .045

(0.584 – 1.143)

HALF LEAD

OPTION

CORNER LEADS OPTION

(4 PLCS)

.045 – .065

(1.143 – 1.651)

NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE

OR TIN PLATE LEADS

N8 1002

.065

(1.651)

TYP

.045 – .065

(1.143 – 1.651)

.130

± .005

(3.302

± 0.127)

.020

(0.508)

MIN

.018

± .003

(0.457

± 0.076)

.120

(3.048)

MIN

12

3

4

87

6

5

.255

± .015*

(6.477

± 0.381)

.400*

(10.160)

MAX

.008 – .015

(0.203 – 0.381)

.300 – .325

(7.620 – 8.255)

.325

+.035

–.015

+0.889

–0.381

8.255

()

NOTE:

1. DIMENSIONS ARE

INCHES

MILLIMETERS

*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)

.100

(2.54)

BSC

.016 – .050

(0.406 – 1.270)

.010 – .020

(0.254 – 0.508)

× 45°

0

°– 8° TYP

.008 – .010

(0.203 – 0.254)

SO8 0303

.053 – .069

(1.346 – 1.752)

.014 – .019

(0.355 – 0.483)

TYP

.004 – .010

(0.101 – 0.254)

.050

(1.270)

BSC

1

2

3

4

.150 – .157

(3.810 – 3.988)

NOTE 3

8

7

6

5

.189 – .197

(4.801 – 5.004)

NOTE 3

.228 – .244

(5.791 – 6.197)

.245

MIN

.160

±.005

RECOMMENDED SOLDER PAD LAYOUT

.045

±.005

.050 BSC

.030

±.005

TYP

INCHES

(MILLIMETERS)

NOTE:

1. DIMENSIONS IN

2. DRAWING NOT TO SCALE

3. THESE DIMENSIONS DO NOT INCLUDE

MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS

SHALL NOT EXCEED .006" (0.15mm)