0.5W, 250µA IZT , Bare Die Zener Diode

Silicon Planar Zener diode in bare die form – 5% tolerance



Sharp Reverse Characteristics



Low Reverse Current Levels



High Reliability Gold Back Metal



High Reliability tested grades.

Rev 1.0

07/07/17

Features:

330 (12.99)

210 (8.27)

CHIP BACKSIDE IS CATHODE

Ordering Information

The following part suffixes apply:



No suffix - MIL-STD-750 /2073 Visual Inspection



“H” - MIL-STD-750 /2073 Visual Inspection

+ MIL-PRF-38534 Class H LAT



“K” - MIL-STD-750 /2073 Visual Inspection

+ MIL-PRF-38534 Class K LAT

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

Supply Formats:

Mechanical Specification

ANODE

Die Dimensions in µm (mils)

Die Size (Unsawn)

330 x 330

12.99 x 12.99

µm

mils

Anode Pad Size



Default – Die in Waffle Pack (400 per tray capacity)

210 x 210

8.27 x 8.27

µm

mils

Die Thickness



Sawn Wafer on Tape – By specific request



Unsawn Wafer – By specific request



Tighter VZ tolerances:

2% - B grade, 1% - A grade – Specific request

200

7.87

µm

mils

Top Metal Composition

Al

Back Metal Composition

Au

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