Pin description and connections

PM8834

6/21

DocID15086 Rev 4

Pin description and connections

PM8834

6/21

DocID15086 Rev 4

2.2

Thermal data

Note:

Maximum power dissipation and derating factor are estimated assuming 125 °C as

maximum operating junction temperature.

Table 3. Thermal data

Symbol

Parameter

Value

Unit

TMAX

Maximum junction temperature

150

°C

TSTG

Storage temperature range

-40 to 150

°C

TJ

Junction temperature range

-40 to 150

°C

TA

Operating ambient temperature range

-40 to 105

°C

SO8

RTHJA

Thermal resistance junction to ambient (device soldered

on 2s2p PC board - 67 mm x 67 mm)

85

°C/W

RTHJC

Thermal resistance junction to case

40

°C/W

PTOT

Maximum power dissipation at 70 °C (device soldered on

2s2p PC board - 67 mm x 67 mm)

0.65

W

DF

Derating factor above 70 °C

12

mW/°C

MSOP8

RTHJA

Thermal resistance junction to ambient (device soldered

on 2s2p PC board - 67 mm x 67 mm)

50

°C/W

RTHJC

Thermal resistance junction to case

10

°C/W

PTOT

Maximum power dissipation at 70 °C (device soldered on

2s2p PC board - 67 mm x 67 mm)

1.1

W

DF

Derating factor above 70 °C

20

mW/°C