4 Specifications

4.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage range

–0.5

7

V

IIK

Input clamp current(2)

VI < 0 or VI > VCC

±20

mA

IOK

Output clamp current(2)

VO < 0 or VO > VCC

±20

mA

IO

Continuous output current

VO = 0 to VCC

±35

mA

Continuous current through VCC or GND

±70

mA

TJ

Junction temperature

150

℃

Tstg

Storage temperature range

–65

150

℃

(1)

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

4.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)

SN54HCT240

SN74HCT240

UNIT

MIN

NOM

MAX

MIN

NOM

MAX

VCC

Supply voltage

4.5

5

5.5

4.5

5

5.5

V

VIH

High-level input voltage

VCC = 4.5 V to 5.5 V

2

2

V

VIL

Low-level input voltage

VCC = 4.5 V to 5.5 V

0.8

0.8

V

VI

Input voltage

0

VCC

0

VCC

V

VO

Output voltage

0

VCC

0

VCC

V

Δt/Δv

Input transition rise/fall time

500

500

ns

TA

Operating free-air temperature

−55

125

−40

85

°C

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

4.3 Thermal Information

THERMAL METRIC

DGS

(VSSOP)

DW (SOIC)

N (PDIP)

NS (SOP)

PW

(TSSOP)

UNIT

20 PINS

20 PINS

20 PINS

20 PINS

20 PINS

RθJA

Junction-to-ambient thermal

resistance(1)

130.6

109.1

84.6

113.4

131.8

°C/W

RθJC(top)

Junction-to-case (top) thermal

resistance

68.7

76

72.5

78.6

72.2

°C/W

RθJB

Junction-to-board thermal resistance

85.4

77.6

65.3

78.4

82.8

°C/W

ψJT

Junction-to-top characterization

parameter

10.5

51.5

55.3

47.1

21.5

°C/W

ψJB

Junction-to-board characterization

parameter

85.0

77.1

65.2

78.1

82.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal

resistance

N/A

N/A

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

SN54HCT240, SN74HCT240

SCLS174H – MARCH 1984 – REVISED AUGUST 2024

www.ti.com

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