1995 Feb 06

8

Philips Semiconductors

Product specification

4

× 4 video switch matrix

TDA8540

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134).

Notes

1. Human Body Model (HBM): in accordance with UZW-BO/FQ-A302.

2. Machine Model (MM): in accordance with UZW-BO/FQ-B302 (stress reference pins: AGND and DGND

THERMAL CHARACTERISTICS

OPERATING CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

supply voltage (pin 13)

−0.3

+9.1

V

total power dissipation

−

750

mW

driver supply voltage

−0.3

+13.8

V

IN0 to IN3

video input voltage

−0.3

+7.2

V

OUT0 to OUT3

video output voltage

−0.3

+7.2

V

D0, D1

control output voltage

−0.3

+7.2

V

SDA, SDL

−0.3

+8.8

V

S0 to S2

sub-address input voltage

−0.3

+8.8

V

IC storage temperature

−55

+125

°C

junction temperature

−

+150

°C

electrostatic handling

HBM; note 1

−1500

+1500

V

MM; note 2

−200

+200

V

SYMBOL

PARAMETER

VALUE

UNIT

thermal resistance from junction to ambient in free air

SOT146-1

60 (typ.)

K/W

SOT163-1

85 (typ.)

K/W

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

General

supply voltage (pin 13)

7.2

−

8.8

V

operating ambient temperature

0

−

70

°C

Video inputs (pins 6, 8, 10 and 12)

external capacitor

−

100

−

nF

C signal amplitude (peak-to-peak value)

note 1

−−

1V

CVBS or Y-signal amplitude

(peak-to-peak value)

note 2

−−

1.5

V

Video drivers (pins 4 and 15)

external collector resistor

note 3

−

25

−Ω

external decoupling capacitor

note 4

−

22

−µF