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TC72 Datasheet(PDF) 18 Page - Microchip Technology |
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TC72 Datasheet(HTML) 18 Page - Microchip Technology |
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18 / 24 page ![]() TC72 DS21743A-page 18 2002 Microchip Technology Inc. 8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN) H Exposed Pad Length Thermal Via Diameter *Controlling Parameter Termal Via Pitch Drawing No. C04-2062 Exposed Pad Width H V P1 G2 .012 .130 .047 Terminal Land Pattern I.D. Terminal Land Width Terminal Land Length Terminal Land Pattern O.D. Terminal Pitch p Units Z A1 Y X Dimension Limits .057 .134 .026 BSC MIN INCHES NOM 0.30 1.20 3.30 3.40 0.65 BSC MILLIMETERS* .060 .157 1.45 MIN MAX NOM 1.53 4.00 MAX Y G2 p X CP Z G P1 THERMAL VIAS ON 4 LAYER PC BOARD DFN LAND PATTERN OPTIONAL TWO LAYER PCB LAND PATTERN PCB LAND PATTERN OPTIONAL FOUR LAYER 0.42 0.35 .014 .017 .033 .035 0.85 0.88 1.50 1.45 .059 .057 Exposed Pad Clearance .006 CP 0.15 0V (Note 1) Exposed pad dimensions vary with paddle size. 1. Notes: Interior Lead Clearance Z .071 1.80 Optional Exposed Pad Length .130 H2 3.30 H2 TYPCAL SOLDER MASKS Minimum Solder Mask Clearance M .002 0.05 M (TYP) |
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