DAC−08 SERIES

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2

BIAS

NETWORK

CURRENT

SWITCHES

MSB

LSB

V+

13

1

5

6

7

8

9

10

11

12

14

15

16

3

4

2

COMP.

V−

REFERENCE

AMPLIFIER

VREF(+)

VREF(−)

B1

VLC

B2

B3

B4

B5

B6

B7

B8

IOUT

+

−

IOUT

Figure 1. Block Diagram

PIN FUNCTION DESCRIPTION

Pin # N Package / D Package

Symbol

Description

1/5

Logic Control Voltage

2/6

Inverted Output Current

3/7

V−

Negative Power Supply

4/8

Non−Inverted Output Current

5/9

Output 1, Most Significant Bit (MSB)

6/10

Output 2

7/11

Output 3

8/12

Output 4

9/13

Output 5

10/14

Output 6

11/15

Output 7

12/16

Output 8, Least Significant Bit (LSB)

13/1

V+

Positive Power Supply

14/2

Positive Reference Voltage

15/3

Negative Reference Voltage

16/4

COMPEN

Compensator Capacitor Pin

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Power Supply Voltage

V+ to V−

36

V

Digital Input Voltage

V− to V− plus 36 V

−

Logic Threshold Control

V− to V+

−

Applied Output Voltage

V− to +18

V

Reference Current

5.0

mA

Reference Amplifier Inputs

−

Maximum Power Dissipation

N Package

D Package

1450

1090

mW

Thermal Resistance, Junction−to−Ambient

N Package

D Package

75

105

°C/W

Lead Soldering Temperature (10 sec max)

230

°C

Operating Temperature Range

0 to +70

°C

Operating Junction Temperature

150

°C

Storage Temperature Range

−65 to +150

°C

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values

(not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage

may occur and reliability may be affected.

1. Derate above 25

°C, at the following rates:

N package at 13.3 mW/

°C

D package at 9.5 mW/

°C.