MCP1603-ADJISLASHOS datasheet(11/26 Pages) MICROCHIP

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DS22042A-page 11

MCP1603

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

PIN FUNCTION TABLE

3.1

Power Supply Input Voltage Pin

(VIN)

Connect the input voltage source to VIN. The input

source must be decoupled to GND with a 4.7 µF

capacitor.

3.2

Ground Pin (GND)

Ground pin for the device. The loop area of the ground

traces should be kept as minimal as possible.

3.3

Shutdown Control Input Pin

(SHDN)

The SHDN pin is a logic-level input used to enable or

disable the device. A logic high (> 45% of VIN) will

enable the regulator output. A logic-low (< 15% of VIN)

will ensure that the regulator is disabled.

3.4

Feedback / Output Voltage Pin

(VFB/VOUT)

For adjustable output options, connect the center of the

output voltage divider to the VFB/VOUT pin. For fixed-

output voltage options, connect the output directly to

the VFB/VOUT pin.

3.5

Switch Node, Buck Inductor

Connection Pin (LX)

Connect the LX pin directly to the buck inductor. This

pin carries large signal-level current; all connections

should be made as short as possible.

3.6

Exposed Metal Pad (EP)

For the DFN package, connect the Exposed Pad to

GND, with vias into the GND plane. This connection to

the GND plane will aid in heat removal from the

package.

Pin No.

Symbol

Description

MCP1603

TSOT23

MCP1603L

TSOT23

2x3 DFN

147

VIN

Power Supply Input Voltage Pin

228

GND

Ground Pin

313

SHDN

Shutdown Control Input Pin

454

VFB/VOUT Feedback / Output Voltage Pin

531

Switch Node, Buck Inductor Connection Pin

—

2, 5, 6

No Connect

—

Exposed

Pad

For the DFN package, the center exposed pad is a thermal

path to remove heat from the device. Electrically this pad is at

ground potential and should be connected to GND

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