MCP1827/MCP1827S

DS22001C-page 24

3-Lead Plastic Transistor Outline (AB) [TO-220]

Notes:

1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.

2. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

INCHES

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

3

Pitch

e

.100 BSC

Overall Pin Pitch

e1

.200 BSC

Overall Height

A

.140

–

.190

Tab Thickness

A1

.020

–

.055

Base to Lead

A2

.080

–

.115

Overall Width

E

.357

–

.420

Mounting Hole Center

Q

.100

–

.120

Overall Length

D

.560

–

.650

Molded Package Length

D1

.330

–

.355

Tab Length

H1

.230

–

.270

Mounting Hole Diameter

φP

.139

–

.156

Lead Length

L

.500

–

.580

Lead Shoulder

L1

–

–

.250

Lead Thickness

c

.012

–

.024

Lead Width

b

.015

.027

.040

Shoulder Width

b2

.045

.057

.070

E

Q

D

D1

L1

L

1

2

e

e1

b

b2

N

A2

c

H1

A1

A

P

CHAMFER

OPTIONAL

φ

Microchip Technology Drawing C04-034B