© 2006 Microchip Technology Inc.

DS21796H-page 19

93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

E

E1

D

e

n

b

2

1

c

L

A

A1

A2

ϕ

β

α

MILLIMETERS*

MIN

NOM

MAX

1.20

1.05

0.15

4.50

3.10

0.75

8°

0.20

0.30

8

–

1.00

–

4.40

3.00

0.60

–

–

–

–

0.80

0.05

4.30

2.90

0.45

0°

0.09

0.19

INCHES

MIN

NOM

MAX

8

–

.039

–

.173

.118

.024

–

–

–

.047

.041

.006

.177

.122

.030

8°

.008

.012

–

.031

.002

.169

.114

.018

0°

.004

.007

.026 BSC

0.65 BSC

.252 BSC

6.40 BSC

12° REF

12° REF

12° REF

12° REF

Units

Dimension Limits

Number of Pins

Pitch

Overall Height

Molded Package Thickness

Standoff

Overall Width

Molded Package Width

Molded Package Length

Foot Length

Foot Angle

Lead Thickness

Lead Width

Mold Draft Angle Top

Mold Draft Angle Bottom

*Controlling Parameter

Notes:

1. Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.005" (0.127mm) per side.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

See ASME Y14.5M

REF: Reference Dimension, usually without tolerance, for information purposes only.

See ASME Y14.5M

Drawing No. C04-086

Revised 7-25-06

n

e

A

A2

A1

E

E1

D

L

ϕ

c

b

α

β