93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C

DS21796H-page 20

© 2006 Microchip Technology Inc.

8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Number of Pins

Pitch

Overall Height

Standoff

Contact Thickness

Overall Length

Overall Width

Exposed Pad Length

Exposed Pad Width

Contact Width

Contact Length §

Contact-to-Exposed Pad §

Units

Dimension Limits

N

e

A

A1

A3

D

E

D2

E2

b

L

K

0.80

0.00

1.30

1.50

0.18

0.30

0.20

8

0.50 BSC

0.90

0.02

0.20 REF

2.00 BSC

3.00 BSC

—

—

0.25

0.40

—

1.00

0.05

1.75

1.90

0.30

0.50

—

MIN

NOM

MAX

MILLIMETERS

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package may have one or more exposed tie bars at ends.

3. § Significant Characteristic

4. Package is saw singulated

5. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing No. C04–123, Sept. 8, 2006

A3

A1

NOTE 2

NOTE 1

NOTE 1

E2

D2

BOTTOM VIEW

EXPOSED PAD

K

L

1

2

N

e

b

TOP VIEW

2

1

N

D

E

A