■ Electrical Characteristics (TJ=25℃ unless otherwise noted)

Parameter

Symbol

Conditions

Min

Typ

Max

Units

Static Parameter

Drain-Source Breakdown Voltage

BVDSS

VGS= 0V, ID=-250μA

-20

V

Zero Gate Voltage Drain Current

IDSS

VDS=-20V,VGS=0V,TC=25℃

-1

μA

Gate-Body Leakage Current

IGSS

VGS= ±10V, VDS=0V

±

100

nA

Gate Threshold Voltage

VGS(th)

VDS= VGS, ID=-250μA

-0.4

-

2.0

V

Static Drain-Source On-Resistance

RDS(ON)

VGS= -4.5V, ID=-10A

17

mΩ

VGS= -2.5V, ID=-6.5A

20

VGS= -1.8V, ID=-4.0A

26

Diode Forward Voltage

VSD

IS=-13A,VGS=0V

-1.2

V

Maximum Body-Diode Continuous Current

IS

-13

A

Dynamic Parameters

Input Capacitance

Ciss

VDS=-10V,VGS=0V,f=1MHZ

2992

pF

Output Capacitance

Coss

330

Reverse Transfer Capacitance

Crss

272

Switching Parameters

Total Gate Charge

Qg

VGS=-10V,VDS=-15V,ID=-9.1A

72.8

nC

Gate Source Charge

Qgs

6.6

Gate Drain Charge

Qgd

10.1

Reverse Recovery Charge

Qrr

IF=-6A, di/dt=100A/us

34

Reverse Recovery Time

trr

67

ns

Turn-on Delay Time

tD(on)

VGS=-10V,VDS=-15V, ID=-6A,

RGEN=2.5Ω

7

Turn-on Rise Time

tr

33

Turn-off Delay Time

tD(off)

130

Turn-off Fall Time

tf

132

A.

Pulse Test: Pulse Width≤300us,Duty cycle ≤2%.

B.

RθJA is the sum of the junction-to-lead and lead-to-ambient thermal resistance, where the lead thermal reference is defined as the solder

mounting surface of the drain pins. RθJL is guaranteed by design, while RθJA is determined by the board design. The maximum rating presented here

is based on mounting on a 1 in 2 pad of 2oz copper.

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DMP2022LSS-13

v2.0