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TEA1069 Datasheet(PDF) 28 Page - NXP Semiconductors

Part # TEA1069
Description  Versatile speech/dialler/ringer with music-on-hold
PDF  44 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TEA1069 Datasheet(HTML) 28 Page - NXP Semiconductors

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1998 Jan 08
28
Philips Semiconductors
Product specification
Versatile speech/dialler/ringer with
music-on-hold
TEA1069; TEA1069A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Notes
1. Mostly dependent on the maximum required Tamb and on the voltage between LN and SLPE (see Fig.26 for
TEA1069N or Fig.27 for TEA1069H and TEA1069AH).
2. Calculated for the maximum specified ambient temperature (Tamb =70 °C, see also Fig.26 for TEA1069N or Fig.27
for TEA1069H and TEA1069AH).
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Iline
line current
R9 = 20
Ω; note 1
−
140
mA
IEE
ground supply current through VEE
−
50
mA
Ptot
total power dissipation
R9 = 20
Ω; note 2
TEA1069N
−
770
mW
TEA1069H and TEA1069AH
−
300
mW
Tamb
operating ambient temperature
−25
+70
°C
Tstg
IC storage temperature
−40
+125
°C
Speech part
VLN
positive continuous line voltage
−
12
V
VLN(R)
repetitive line voltage during switch-on or line
interruption
−
13.2
V
VCC
input voltage on pin VCC
−
12
V
Vi
input voltage on pins 1 to 7, 37, 38, 39, 41, 42
VEE − 0.7 VCC + 0.7 V
Dialler/ringer part
VDD
supply voltage
−0.7
+7
V
Vi
input voltages on pins 8 to 22, 24, 26 to 35
VEE − 0.7 VDD + 0.7 V
II
DC input current on pins 8 to 22, 24, 26 to 35
−10
+10
mA
IO
DC output current on pins 8 to 22, 24, 26 to 35
−10
+10
mA
Po
power dissipation per output on pins 8 to 22,
24, 26 to 35
−
30
mW
SYMBOL
PARAMETER
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient in free air mounted on
glass epoxy board 28.5
× 19.1 × 1.5 mm
TEA1069N
63
K/W
TEA1069H and TEA1069AH
116
K/W



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