Data Sheet

OP400

Rev. I | Page 5 of 15

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

Supply Voltage

±20 V

Differential Input Voltage

±30 V

Input Voltage

Supply voltage

Output Short-Circuit Duration

Continuous

Storage Temperature Range

P, Y, S Packages

−65°C to +150°C

Lead Temperature (Soldering 60 sec)

300°C

Junction Temperature (TJ) Range

−65°C to +150°C

Operating Temperature Range

OP400A

−55°C to +125°C

OP400E, OP400F

−25°C to +85°C

OP400G

0°C to 70°C

OP400H

−40°C to +85°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Absolute maximum ratings apply to both dice and packaged

parts, unless otherwise noted.

THERMAL RESISTANCE

θJA is specified for worst-case mounting conditions, that is, θJA is

specified for device in socket for CERDIP and PDIP packages;

θJA is specified for device soldered to printed circuit board for

SOIC package.

Table 5. Thermal Resistance

Package Type

θJA

θJC

Unit

14-Lead Ceramic DIP

94

10

°C/W

14-Lead Plastic DIP

76

33

°C/W

16-Lead SOIC

88

23

°C/W

ESD CAUTION