Data Sheet

ADL5535

Rev. A | Page 11 of 16

BASIC CONNECTIONS

The basic connections for operating the ADL5535 are shown in

Figure 16. Recommended components are listed in Table 5. The

input and output should be ac-coupled with appropriately sized

capacitors (device characterization was performed with 0.1 μF

capacitors). A 5 V dc bias is supplied to the amplifier through

the bias inductor connected to RFOUT (Pin 3). The bias voltage

should be decoupled using a 1 µF capacitor, a 1.2 nF capacitor,

and a 68 pF capacitor.

GND

1

2

3

C6

1µF

L1

470nH

GND

RFOUT

C5

C4

C2

C1

VCC

RFIN

ADL5535

(2)

0.1µF

1.2nF

68pF

0.1µF

Figure 16. Basic Connections

SOLDERING INFORMATION AND RECOMMENDED

PCB LAND PATTERN

Figure 17 shows the recommended land pattern for the ADL5535.

To minimize thermal impedance, the exposed paddle on the

package underside, along with Pin 2, should be soldered to a

ground plane. If multiple ground layers exist, they should be

stitched together using vias. For more information about land

pattern design and layout, refer to the AN-772 Application

Note, A Design and Manufacturing Guide for the Lead Frame

Chip Scale Package (LFCSP).

3.00mm

3.48mm

1.80mm

5.37mm

0.20mm

0.762mm

0.635mm

0.62mm

0.86mm

0.86mm

1.50mm

1.27mm

Figure 17. Recommended Land Pattern

Table 5. Recommended Components for Basic Connections

Frequency

C1

C2

L1

C4

C5

C6

20 MHz to 1000 MHz

0.1 µF

0.1 µF

470 nH (Coilcraft 0603LS-NX or equivalent)

68 pF

1.2 nF

1 µF