MIC2800

DS20005839C-page 8

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TABLE 1-5:

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Storage Temperature Range

TS

-65

—

+150

°C

Lead Temperature

—

—

—

+260

°C

Soldering, 10 sec.

Junction Temperature

TJ

-40

—

+125

°C

Package Thermal Resistance

16-Ld QFN

θJA

—45

—

°C/W

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.