data sheet

MCM-PBGA

Features:

Thermal Performance:

Reliability:

Innovative designs and expanding package offerings provide

a platform from prototype-to-production.

• Ball counts up to 1156

• 13.0 mm to 40.0 mm body sizes

• 1.00, 1.27 & 1.50 mm ball pitch available

• Perimeter, stagger and full ball arrays

• Special packaging for memory available

• 2, 4, or 6 layer construction, ground / power

• Full in-house design capability

• JEDEC MS-034 standard outlines

• MCM under high volume manufacturing in all sites

• Enhanced electrical performance, shorter signal paths

and reduced package parasitics

• 2-8 active devices

• 200-600 wire bonds

• Passives can be added by utilizing the SMT

equipment located in the SiP line

Multi layer PCB, 0 air flow

PCB

Cu

Theta JA

Pkg

Body Size Layer Thickness

(°C/W)

272

27.0 x 27.0

4

36 µm19

388

35.0 x 35.0

4

36 µm16

Amkor assures you reliable performance by continuously

monitoring key indices:

• Moisture sensitivity

JEDEC Level 3

characterization

30 °C/60% RH/192 hours

• High temp op life

125 °C, 6V, 1000 hours

• High temp storage

150 °C, 1000 hours

• Autoclave or unbiased hast 130 °C/85% RH/96 hours

• Temp cycle

-55/+125 °C, 1000 cycles

MCM-PBGA Packages:

The MCM-PBGA (Multi-Chip Module Plastic Ball Grid

Array) by Amkor incorporates the latest technology

in high-density plastic IC packaging. The high-speed

performance and thermal advantages of the PBGA

package provide the platform to mix semiconductor

technologies such as analog, digital, bipolar, CMOS,

ASIC, memory, etc., in a single IC package.

The affordability of our MCM-PBGAs enable systems

designers to realize their vision of new, advanced

or improved applications. Our designs are optimized

to use standard PBGA package outline tooling to save

you costs and utilize a proven BGA infrastructure.

Additionally, we work with you to produce the most

efficient substrate circuit design that will enhance

the operation and performance of your IC chips.

Our advanced in-house design center and electrical

test support services complete the turn-key solution.

Applications:

Amkor’s MCM-PBGA is an excellent platform for reducing

form factor and size while combining semiconductor

technologies. MCM-PBGAs are perfect for any application

where size, weight, electrical performance, board density

and SMT yields are important considerations, such as

ASICs, cable and DSL modems, wireless telecommunica-

tions and electronic automotive components.

LAMINATE

VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND

TO VIEW THE MOST CURRENT PRODUCT INFORMATION

www.amkor.com

DS 540G

Rev Date: 05 ‘07

.