data sheet

Features:

Thermal Resistance:

g

Electrical:

Reliability:

(PSOP / PSSOP)

This Amkor-developed family of power IC

packages significantly increases the thermal

efficiency of power constrained standard SOIC

Theta JA up to 50% over a standard SOIC

thereby expanding the margin of operating

parameters. The large integrated exposed

copper heatslug to which the IC chip is direct-

ly attached results in an increased ability to

dissipate heat. The leadframe and heatslug

are mechanically attached, leaving the leads

electrically isolated. The package is offered in

a low stand-off (.002) heatslug down ver-

sion, which is MS-012, MS-013, or MO-166

JEDEC compliant depending on the package

you choose. These flexibilities still allow

maximum thermal management by directly

soldering the slug to the PCB. Furthermore,

there are two types of PSOPs (2 and 3)

available with various features and benefits

to address different market application

needs.

Applications:

Increased end-application densities and

shrinking product sizes demand more from

IC packages. PSOPs give designers the

needed margin for designing and producing

high performing products such as telecom,

disk drives, pagers, wireless, CATV/RF

modules, radio, automotive/industrial and

other similar applications. GaAs, SiGe and

hi-speed silicon technologies work especially

well in PSOP packages due to added

shielding and grounding capabilities.

LEADFRAME

www.amkor.com

Exceptional performance through the innovative design of PSOPs offer:

die attach

PSOP 2

(.150" body) - 8, 16 lead

(.300" body) - 16, 20, 24, 28 lead

PSOP 3

(11 x 15.9 mm body) - 20, 24, 30, 36, 44 lead

PSSOP

(.150" body) - 16, 28 lead

Single Layer PCB

Theta JA (°C/W) by Velocity (LFPM)

Body

Pad

0

200

500

Pkg

Size

Size

S/NS

S/NS

S/NS

PSOP 2

8

3.8 x 4.9

2.3 x 3.1

144.1/157.6 120.2/131.1 104.2/112.8

16

3.8 x 9.9

2.3 x 4.9

91.2/95.9

72.2/75.2

61.8/64.4

PSOP 3

20

11 x 15.9

7.5 x 7.9

50.8/52.4

35.7/37.6

27.8/28.8

Multi-Layer PCB

Theta JA (°C/W) by Velocity (LFPM)

Body

Pad

0

200

500

Pkg

Size

Size

S/NS

S/NS

S/NS

PSOP 2

8

3.8 x 4.9

2.3 x 3.1

51.8/95.3

45.5/86.5

42.6/80.6

16

3.8 x 9.9

2.3 x 4.9

30.2/51.6

25.0/45.3

23.0/42.3

PSOP 3

20

11 x 15.9

7.5 x 7.9

19.2/25.7

14.2/20.4

12.2/17.8

JEDEC Standard Test Boards

S - Slug Soldered to Test Board

N/S - Slug Not Soldered to Test Board

Body

Pad

Inductance Capacitance Resistance

Pkg

Size

Size

Lead

(nH)

(pF)

PSOP 2

8 ld

4.9 x 3.9

3.2 x 2.3

Longest

1.120

0.456

9.9

Shortest

0.684

0.344

5.7

PSOP 3

20 ld

11 x 15.9

7.5 x 7.9

Longest

3.130

1.990

30.6

Shortest

1.540

0.604

9.42

PSSOP

16 ld

4.9 x 3.9

1.3 x 3.2

Longest

1.510

0.367

12.8

Shortest

0.885

0.243

8.36

IC chips are assembled in optimized package designs with proven reliable

semiconductor materials.

130 °C/85% RH, no bias, 96 hours

-65/150 °C, 500 cycles

VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND

TO VIEW THE MOST CURRENT PRODUCT INFORMATION

.

DS320G

Rev Date: 01’07