Thermal Enhancement

Some designs and applications require an added margin of thermal

performance (power). Amkor’s easy and cost-effective solution is a heat

spreader. This optional embedded thermal aid improves Theta JA by as

much as 15% (without external heat sinks or fans) by supplementing the

heat dissipation path from the IC chip to the PCB.

Amkor’s MQFP (Metric Quad Flat Pack) packages allow IC packaging

engineers and systems designers the flexibility of growing or

shrinking IC package size based upon application need. Amkor uses

the most up-to-date materials and processes along with advanced

equipment, to ensure successful, reliable performance of our IC

devices. A complete line of MQFP packages are available to provide

security, convenience and success.

MQFP

DATA SHEET | LEADFRAME PRODUCTS

Thermal Performance

Multi-Layer PCB

Package

Body Size

(mm)

Pad Size

(mm)

θJA at (°C/W) by Velocity (LFPM)

0

200

500

32 Ld

7 x 7

5 x 5

67.8

55.9

50.1

100 Ld

14 x 14

8 x 8

41.5

33.4

29.5

144 Ld

20 x 20

8.5 x 8.5

38.0

31.2

28.1

176 Ld

24 x 24

8 x 8

38.3

31.9

29.0

JEDEC standard test boards

*Pre-JEDEC Standard Test Boards, Tested @ 1W

Electrical Performance

Simulated Results @ 100 MHz

Package

Body Size

(mm)

Pad Size

(mm)

Lead

Inductance

(nH)

Capacitance

(pF)

Resistance

(mΩ)

32 Ld

7 x 7

5 x 5

Longest

Shortest

0.904

0.799

0.211

0.202

9.2

7.8

48 Ld

7 x 7

5 x 5

Longest

Shortest

1.110

0.962

0.225

0.200

13.8

12.0

100 Ld

14 x 14

8 x 8

Longest

Shortest

2.300

1.520

0.419

0.322

26.3

17.8

144 Ld

20 x 20

8.5 x 8.5

Longest

Shortest

6.430

4.230

1.100

1.070

62.9

52.6

176 Ld

24 x 24

8 x 8

Longest

Shortest

9.510

5.200

1.270

1.340

89.0

64.0

FEATURES

f

10 x 10 mm to 32 x 32 mm body size

f

44-240 lead counts

f

Custom leadframe design available

f

Die up and down configurations

f

High conductivity copper leadframes

f

JEDEC standard compliant package

outlines

f

Integrated thermal enhancement

available with heat spreader

f

Fine pitch wirebond capability

f

Pb-free material sets

APPLICATIONS

Amkor’s MQFP line is adapted to

meet the increasing challenges of

advanced Digital Signal Processors

(DSP), microcontrollers, ASIC, gate

arrays (FPGA/PLD), and other

technologies. These packages fill

application needs in commercial,

office, industrial and other product

areas.