7

HV852

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline

Doc.# DSFP-HV852

NR061907

1

8

Seating

Plane

Gauge

Plane

θ

L

L1

L2

E

E1

D

e

b

A

A2

A1

Seating

Plane

A

A

Top View

Side View

View A-A

View B

View B

θ1 (x4)

Note 1

(Index Area

D1/2 x E1/2)

Symbol

A

A1

A2

b

D

E

E1

e

L

L1

L2

θ

θ1

Dimen-

sion

(mm)

MIN

0.75

0.00

0.75

0.22

2.80

4.65

2.80

0.65

BSC

0.40

0.95

REF

0.25

BSC

NOM

-

-

0.85

-

3.00

4.90

3.00

0.60

-

-

MAX

1.10

0.15

0.95

0.38

3.20

5.15

3.20

0.80

JEDEC Registration MO-187, Variation AA, Issue E, Dec. 2004.

Drawings not to scale.

Note 1:

A Pin 1 identifier must be located in the index area indicated. The Pin 1 identifier may be either a mold, or an embedded metal or marked feature.

8-Lead MSOP Package Outline (MG)

3x3mm body, 1.10mm height (max), 0.65mm pitch