TMUX7612 datasheet(3/54 Pages) TI

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4 Pin Configuration and Functions

SEL1

SEL2

VSS

VDD

GND

N.C.

SEL4

SEL3

Not to scale

Figure 4-1. PW Package, 16-Pin TSSOP (Top View)

VSS

VDD

GND

N.C.

Not to scale

Thermal

Pad

Figure 4-2. RUM Package, 16-Pin WQFN (Top View)

Table 4-1. Pin Functions

TYPE(1)

DESCRIPTION

NAME

TSSOP

WQFN

I/O

Drain pin 1. Can be an input or output.

I/O

Drain pin 2. Can be an input or output.

I/O

Drain pin 3. Can be an input or output.

I/O

Drain pin 4. Can be an input or output.

GND

Ground (0 V) reference.

N.C.

—

No internal connection. Can be shorted to GND or left floating

I/O

Source pin 1. Can be an input or output.

I/O

Source pin 2. Can be an input or output.

I/O

Source pin 3. Can be an input or output.

I/O

Source pin 4. Can be an input or output.

SEL1

Logic control input 1, has internal pull-down resistor. Controls channel 1 state as provided in Table 7-1.

SEL2

Logic control input 2, has internal pull-down resistor. Controls channel 2 state as provided in Table 7-1.

SEL3

Logic control input 3, has internal pull-down resistor. Controls channel 3 state as provided in Table 7-1.

SEL4

Logic control input 4, has internal pull-down resistor. Controls channel 4 state as provided in Table 7-1.

VDD

Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a

decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND

VSS

Negative power supply. This pin is the most negative power-supply potential. For reliable operation, connect a

decoupling capacitor ranging from 0.1µF to 10 µF between VSS and GND. In single-supply applications, this

pin should be connected to ground.

Thermal Pad

—

The thermal exposed pad is connected internally. It is recommended that the pad be tied to VSS for best

performance.

(1)

I = input, O = output, I/O = input and output, P = power.

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TMUX7612

SCDS466A – AUGUST 2023 – REVISED DECEMBER 2024

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