SC1211VXSTRT datasheet(10/11 Pages) SEMTECH

10 / 11 page

 2005 Semtech Corp.

www.semtech.com

POWER MANAGEMENT

SC1211VX

Applications Information (Cont.)

whole during PCB layout. Refer to Semtech SC2643VX/

SC1211VX EVB Layout Guideline.

For the SC1211VX driver, the following guidelines are

typically recommended during PCB layout:

1. Place the SC1211VX close to the FETs for shortest

gate drive traces and ground return paths.

2. Connect the bypass capacitor as close as possible to

pin VCC and PGND for decoupling.

3. Locate the components of the bootstrap circuit close

to the SC1211VX.

SOLDERING CONSIDERA

SOLDERING CONSIDERATION

TION

The exposed die pad of the SC1211VX is used for ground

return and thermal release of the driver. The pad must

be soldered to the ground plane that is further connected

to the system ground in the inner layer through multiple

vias. For better electrical and thermal performance, it is

recommended to use all copper available under the driver

as the ground plane, and place the vias as close as pos-

sible to the solder pad. Meanwhile, the vias have to be

masked out to prevent solder leakage during reflow. The

layout arrangement is detailed in the above figure, which

also can be found in the “Land Pattern – Power SOIC-8”

section.

Solder Pad

Solder Mask

Vias

Copper

SC1211VXSTRT Datasheet(PDF) 10 Page - Semtech Corporation