Pin Assignment

Pad Assignment

Chip size: 151

´ 157 (mil)

2

* The IC substrate should be connected to VDD in the PCB layout artwork.

HT16220

Rev. 1.20

2

May 19, 2004

4 1

5 1

3 7

3 8

3 9

4 0

4 9

4 8

4 7

4 6

4 5

4 4

4 3

4 2

5 0

3 3

3 4

3 5

3 6

C S

B Z

N C

R D

W R

D A T A

V S S

V D D

V L C D

I R Q

B Z

N C

O S C O

O S C I

T 1

N C

C O M 0

T 2

T 3

S E G 1 2

N C

S E G 8

S E G 9

S E G 1 0

S E G 1 1

N C

S E G 1 9

S E G 1 8

S E G 1 7

S E G 1 6

S E G 1 5

S E G 1 4

S E G 1 3

N C

S E G 6

N C

N C

S E G 7

1

1 1

2

3

4

5

6

7

8

9

1 0

1 2

1 3

1 4

1 5

1 8

1 9

1 6

1 7

H T 1 6 2 2 0

6 4 Q F P - A

1

2 9

2

3 0

3

3 1

4

3 2

5

3 3

6

3 4

7

3 5

8

3 6

9

3 7

1 0

3 8

1 1

3 9

1 2

4 0

1 3

4 1

1 4

4 2

1 5

4 3

1 6

4 4

1 7

4 5

1 8

4 6

1 9

4 7

2 0

4 8

2 1

4 9

2 2

5 0

2 3

5 1

2 4

5 2

2 5

5 3

2 6

5 4

2 7

5 5

2 8

C S

R D

W R

D A T A

V S S

V D D

V L C D

I R Q

B Z

B Z

O S C O

O S C I

T 1

T 2

T 3

S E G 1 9

S E G 1 8

S E G 1 7

S E G 1 6

S E G 1 5

S E G 1 4

S E G 1 3

S E G 1 2

S E G 1 1

S E G 1 0

S E G 9

S E G 8

S E G 7

( 0 , 0 )