Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

TLV2455AIPWR

ACTIVE

TSSOP

PW

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2455AIPWRG4

ACTIVE

TSSOP

PW

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2455CD

ACTIVE

SOIC

D

16

40

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2455CDG4

ACTIVE

SOIC

D

16

40

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2455CN

ACTIVE

PDIP

N

16

25

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

TLV2455CNE4

ACTIVE

PDIP

N

16

25

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

TLV2455CPW

ACTIVE

TSSOP

PW

16

90

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2455CPWG4

ACTIVE

TSSOP

PW

16

90

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2455CPWR

ACTIVE

TSSOP

PW

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2455CPWRG4

ACTIVE

TSSOP

PW

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2455ID

ACTIVE

SOIC

D

16

40

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2455IDG4

ACTIVE

SOIC

D

16

40

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2455IDR

ACTIVE

SOIC

D

16

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2455IDRG4

ACTIVE

SOIC

D

16

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2455IN

ACTIVE

PDIP

N

16

25

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

TLV2455INE4

ACTIVE

PDIP

N

16

25

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

TLV2455IPW

ACTIVE

TSSOP

PW

16

90

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2455IPWG4

ACTIVE

TSSOP

PW

16

90

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TLV2455IPWRG4

ACTIVE

TSSOP

PW

16

TBD

Call TI

Call TI

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

PACKAGE OPTION ADDENDUM

www.ti.com

9-Oct-2007

Addendum-Page 6