STA333ML

Package information

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Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 8.

PowerSSO36 exposed pad mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

2.15

2.47

0.084

0.097

A2

2.15

2.40

0.084

0.094

a1

0

0.075

0

0.003

b

0.18

0.36

0.007

0.014

c

0.23

0.32

0.009

0.012

10.10

10.50

0.398

0.413

7.4

7.6

0.291

0.299

e

0.5

0.019

e3

8.5

0.335

F

2.3

0.090

G

0.10

0.004

G1

0.06

0.002

H

10.10

10.50

0.398

0.413

h

0.40

0.016

k5˚

5˚

L

0.55

0.90

0.022

0.035

M

4.3

0.169

N

10˚

10˚

O

1.2

0.047

Q

0.8

0.031

S

2.9

0.114

T3.65

0.144

U

1.0

0.039

X

4.1

4.7

0.161

0.185

Y

6.5

7.3

0.256

0.287

(1) "D” and “E" do not include mold flash or protrusions Mold flash

or protrusions shall not exceed 0.15 mm per side(0.006”)

PowerSSO-36

7587131 A

(exposed pad)

G

LEAD COPLANARITY

BOTTOM VIEW

D

e3

0.1

A

M

B

b

e

A

Y

T

L

hx45

U

O

B